HIP2101IBZ vs HIP2101EIBZ feature comparison

HIP2101IBZ Intersil Corporation

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HIP2101EIBZ Renesas Electronics Corporation

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Part Life Cycle Code Transferred Active
Ihs Manufacturer INTERSIL CORP RENESAS ELECTRONICS CORP
Part Package Code DFN, QFN, SOIC SOICN-EP
Package Description SOP, SOP8,.25 HLSOP,
Pin Count 12, 16, 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 26 Weeks 26 Weeks, 1 Day
High Side Driver YES YES
Interface IC Type HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e3 e3
Length 4.9 mm 4.89 mm
Moisture Sensitivity Level 1 2
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Peak Current Limit-Nom 2 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP HLSOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
Seated Height-Max 1.75 mm 1.68 mm
Supply Voltage-Max 14 V 14 V
Supply Voltage-Min 9 V 9 V
Supply Voltage-Nom 12 V 12 V
Surface Mount YES YES
Technology CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Matte Tin (Sn) - annealed MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Turn-off Time 0.056 µs 0.056 µs
Turn-on Time 0.056 µs 0.056 µs
Width 3.9 mm 3.9 mm
Base Number Matches 2 2
Pbfree Code Yes
Manufacturer Package Code M8.15C
Date Of Intro 2017-10-27
Samacsys Manufacturer Renesas Electronics

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