HIP2101IBZT vs HIP2101IBZT feature comparison

HIP2101IBZT Renesas Electronics Corporation

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HIP2101IBZT Intersil Corporation

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP INTERSIL CORP
Part Package Code SOICN DFN, QFN, SOIC
Pin Count 8 12, 16, 8
Manufacturer Package Code M8.15
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 26 Weeks, 1 Day 26 Weeks
Samacsys Manufacturer Renesas Electronics
High Side Driver YES YES
Interface IC Type HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e3 e3
Length 4.9 mm 4.9 mm
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Peak Current Limit-Nom 2 A 2 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max 14 V 14 V
Supply Voltage-Min 9 V 9 V
Supply Voltage-Nom 12 V 12 V
Surface Mount YES YES
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN Matte Tin (Sn) - annealed
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Turn-off Time 0.056 µs 0.056 µs
Turn-on Time 0.056 µs 0.056 µs
Width 3.9 mm 3.9 mm
Base Number Matches 2 1
Package Description LEAD FREE, PLASTIC, MS-012AA, SOIC-8
Package Equivalence Code SOP8,.25
Technology CMOS

Compare HIP2101IBZT with alternatives

Compare HIP2101IBZT with alternatives