HIP2101IBZT
vs
LM25101BMA/NOPB
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SOICN
|
|
Pin Count |
8
|
|
Manufacturer Package Code |
M8.15
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Renesas Electronics
|
Texas Instruments
|
High Side Driver |
YES
|
YES
|
Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
4.9 mm
|
4.9 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Peak Current Limit-Nom |
2 A
|
2 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Supply Voltage-Max |
14 V
|
14 V
|
Supply Voltage-Min |
9 V
|
9 V
|
Supply Voltage-Nom |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Turn-off Time |
0.056 µs
|
0.056 µs
|
Turn-on Time |
0.056 µs
|
0.056 µs
|
Width |
3.9 mm
|
3.9 mm
|
Base Number Matches |
2
|
1
|
Package Description |
|
SOIC-8
|
Number of Channels |
|
2
|
Output Current-Max |
|
3 A
|
Package Equivalence Code |
|
SOP8,.25
|
Supply Current-Max |
|
3 mA
|
|
|
|
Compare HIP2101IBZT with alternatives
Compare LM25101BMA/NOPB with alternatives