HIP2101IR vs HIP2101IBZT feature comparison

HIP2101IR Intersil Corporation

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HIP2101IBZT Intersil Corporation

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTERSIL CORP INTERSIL CORP
Part Package Code QFN DFN, QFN, SOIC
Package Description 5 X 5 MM, PLASTIC, MO-220VHHB, QFN-16 LEAD FREE, PLASTIC, MS-012AA, SOIC-8
Pin Count 16 12, 16, 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks 26 Weeks
High Side Driver YES YES
Interface IC Type HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code S-XQCC-N16 R-PDSO-G8
JESD-609 Code e0 e3
Length 5 mm 4.9 mm
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 16 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Peak Current Limit-Nom 2 A 2 A
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Equivalence Code LCC16,.2SQ,32 SOP8,.25
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.75 mm
Supply Voltage-Max 14 V 14 V
Supply Voltage-Min 9 V 9 V
Supply Voltage-Nom 12 V 12 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN LEAD Matte Tin (Sn) - annealed
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD DUAL
Turn-off Time 0.056 µs 0.056 µs
Turn-on Time 0.056 µs 0.056 µs
Width 5 mm 3.9 mm
Base Number Matches 8 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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