HIP4080AIBZ
vs
HIP4080AIB
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
SOICW
|
|
| Pin Count |
20
|
|
| Manufacturer Package Code |
M20.3
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
FULL BRIDGE BASED MOSFET DRIVER
|
FULL BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e3
|
e0
|
| Length |
12.8 mm
|
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP20,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
2.65 mm
|
|
| Supply Current-Max |
3 mA
|
|
| Supply Voltage1-Max |
15 V
|
|
| Supply Voltage1-Min |
9.5 V
|
|
| Supply Voltage1-Nom |
12 V
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Turn-off Time |
0.11 µs
|
0.09 µs
|
| Turn-on Time |
0.14 µs
|
0.11 µs
|
| Width |
7.5 mm
|
|
| Base Number Matches |
3
|
4
|
| Rohs Code |
|
No
|
| Input Characteristics |
|
DIFF
|
| Output Characteristics |
|
TOTEM-POLE
|
| Output Peak Current Limit-Nom |
|
2.6 A
|
| Output Polarity |
|
TRUE
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
MOS
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|