HIP6018BCB
vs
LM22675MR-ADJ
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOIC-24
|
HLSOP, SOP8,.25
|
| Pin Count |
24
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING REGULATOR
|
| Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
13.2 V
|
42 V
|
| Input Voltage-Min |
10.8 V
|
4.5 V
|
| Input Voltage-Nom |
12 V
|
12 V
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
15.4 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
8
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Current-Max |
1 A
|
1.8 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HLSOP
|
| Package Equivalence Code |
SOP24,.4
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
1.68 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
PUSH-PULL
|
BUCK
|
| Switching Frequency-Max |
215 kHz
|
600 kHz
|
| Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
3.9 mm
|
| Base Number Matches |
4
|
2
|
| Additional Feature |
|
ALSO HAS ADJUSTABLE OUTPUTS AS LOW AS 1.285V
|
|
|
|
Compare HIP6018BCB with alternatives
Compare LM22675MR-ADJ with alternatives