HIP6601BECBZ-T vs HIP6601BECBZA feature comparison

HIP6601BECBZ-T Renesas Electronics Corporation

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HIP6601BECBZA Intersil Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP INTERSIL CORP
Package Description SOIC-8 HLSOP,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-11-01
High Side Driver YES YES
Interface IC Type HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e3 e3
Length 4.89 mm 4.89 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HLSOP HLSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Seated Height-Max 1.68 mm 1.68 mm
Supply Voltage-Max 13.2 V 13.2 V
Supply Voltage-Min 10.8 V 10.8 V
Supply Voltage-Nom 12 V 12 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish MATTE TIN Matte Tin (Sn) - annealed
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 2 2
Part Package Code SOIC
Pin Count 8
Moisture Sensitivity Level 3
Output Peak Current Limit-Nom 0.73 A
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Supply Voltage1-Max 12 V
Supply Voltage1-Min 5 V
Time@Peak Reflow Temperature-Max (s) 30

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