HPA01195YFPR
vs
BQ51013RHLR
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
VFBGA,
|
HVQCCN,
|
| Reach Compliance Code |
compliant
|
unknown
|
| JESD-30 Code |
R-PBGA-B28
|
R-PQCC-N20
|
| JESD-609 Code |
e1
|
|
| Length |
3 mm
|
4.5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
20
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.5 mm
|
1 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.88 mm
|
3.5 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
20
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare HPA01195YFPR with alternatives
Compare BQ51013RHLR with alternatives