HSDL3201021
vs
HSDL-3201#021
feature comparison
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Transferred
|
| Ihs Manufacturer |
|
AGILENT TECHNOLOGIES INC
|
| Part Package Code |
|
MODULE
|
| Package Description |
|
,
|
| Pin Count |
|
8
|
| Reach Compliance Code |
|
unknown
|
| HTS Code |
|
8542.39.00.01
|
| Interface IC Type |
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
|
R-XSMA-N8
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
2.7 V
|
| Supply Voltage-Nom |
|
3 V
|
| Supply Voltage1-Max |
|
6 V
|
| Supply Voltage1-Min |
|
2.7 V
|
| Surface Mount |
|
NO
|
| Technology |
|
BICMOS
|
| Temperature Grade |
|
OTHER
|
| Terminal Form |
|
NO LEAD
|
| Terminal Position |
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
| Base Number Matches |
|
2
|
|
|
|