I1740SY01 vs ISD4003-06MXYD feature comparison

I1740SY01 Winbond Electronics Corp

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ISD4003-06MXYD Winbond Electronics Corp

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC DIE
Package Description SOP, DIE,
Pin Count 28 19
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-XUUC-N19
JESD-609 Code e3
Length 17.93 mm
Number of Functions 1 1
Number of Terminals 28 19
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Equivalence Code SOP28,.4 DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 80 s 360 s
Seated Height-Max 2.64 mm
Supply Voltage-Max (Vsup) 5.5 V 3.3 V
Supply Voltage-Min (Vsup) 2.4 V 2.7 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Width 7.52 mm
Base Number Matches 1 2
Technology CMOS

Compare I1740SY01 with alternatives

Compare ISD4003-06MXYD with alternatives