I1790EYIR vs I1740SY01 feature comparison

I1790EYIR Winbond Electronics Corp

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I1740SY01 Winbond Electronics Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code TSOP SOIC
Package Description TSOP1, SOP,
Pin Count 28 28
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-PDSO-G28
JESD-609 Code e3 e3
Length 11.8 mm 17.93 mm
Number of Functions 1 1
Number of Terminals 28 28
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 180 s 80 s
Seated Height-Max 1.2 mm 2.64 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.55 mm 1.27 mm
Terminal Position DUAL DUAL
Width 8 mm 7.52 mm
Base Number Matches 1 1

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