ICL3222ECVZ-T
vs
ICL3222ECVZ
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
SOIC, SSOP, TSSOP
|
|
| Package Description |
TSSOP, TSSOP20,.25
|
,
|
| Pin Count |
18, 20, 20
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks
|
|
| Differential Output |
NO
|
|
| Driver Number of Bits |
2
|
|
| Input Characteristics |
SCHMITT TRIGGER
|
|
| Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
| Interface Standard |
EIA-232; TIA-232; V.24; V.28
|
|
| JESD-30 Code |
R-PDSO-G20
|
|
| JESD-609 Code |
e3
|
|
| Length |
6.5 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
20
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Out Swing-Min |
10 V
|
|
| Output Low Current-Max |
0.0016 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP20,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Receive Delay-Max |
|
|
| Receiver Number of Bits |
2
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Current-Max |
1 mA
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Supply Voltage-Nom |
3.15 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
|
| Base Number Matches |
3
|
4
|
| Date Of Intro |
|
2020-10-31
|
|
|
|
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