ICM7555CD,623 vs MC1455BDR2 feature comparison

ICM7555CD,623 NXP Semiconductors

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MC1455BDR2 Motorola Mobility LLC

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOIC SOIC
Package Description 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 SOP,
Pin Count 8 8
Manufacturer Package Code SOT96-1
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE TIMER
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Frequency-Max 0.5 MHz
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm 3.9 mm
Base Number Matches 1 3
Supply Current-Max (Isup) 15 mA

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