ICM7555ID/DG,112 vs SA555D feature comparison

ICM7555ID/DG,112 NXP Semiconductors

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SA555D NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, 0.157 INCH, PLASTIC, SOP-8
Pin Count 8 8
Manufacturer Package Code SOT96-1
Reach Compliance Code unknown unknown
Analog IC - Other Type PULSE SQUARE
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4
Length 4.9 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Frequency-Max 0.5 MHz
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP LSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, LOW PROFILE
Seated Height-Max 1.75 mm 1.68 mm
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 6
ECCN Code EAR99
HTS Code 8542.39.00.01
Package Equivalence Code SOP8,.25
Qualification Status Not Qualified

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