ICM7555ID/T3 vs MC1455BDG feature comparison

ICM7555ID/T3 NXP Semiconductors

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MC1455BDG onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ON SEMICONDUCTOR
Part Package Code SOIC SOIC
Package Description LSOP, SOP, SOP8,.25
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE PULSE; RECTANGULAR
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4
Length 4.9 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Frequency-Max 0.5 MHz
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.68 mm 1.75 mm
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Rohs Code Yes
Moisture Sensitivity Level 1
Package Equivalence Code SOP8,.25
Peak Reflow Temperature (Cel) 235
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare ICM7555ID/T3 with alternatives

Compare MC1455BDG with alternatives