ICM7555ID/T3 vs NCV1455BDR2 feature comparison

ICM7555ID/T3 NXP Semiconductors

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NCV1455BDR2 Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code SOIC SOIC
Package Description LSOP, SOP,
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Analog IC - Other Type PULSE PULSE; RECTANGULAR
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4 e0
Length 4.9 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Frequency-Max 0.5 MHz
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE SMALL OUTLINE
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.68 mm 1.75 mm
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS BIPOLAR
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code No
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30

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