ICS93V857YGLFT
vs
ICS86953BYIT-147
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TSSOP
|
QFP
|
| Package Description |
6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48
|
LQFP,
|
| Pin Count |
48
|
32
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
R-PDSO-G48
|
S-PQFP-G32
|
| JESD-609 Code |
e3
|
e0
|
| Length |
12.5 mm
|
7 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
48
|
32
|
| Number of True Outputs |
10
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
LQFP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.1 ns
|
0.075 ns
|
| Seated Height-Max |
1.2 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
6.1 mm
|
7 mm
|
| fmax-Min |
170 MHz
|
62.5 MHz
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
3
|
| Propagation Delay (tpd) |
|
4 ns
|
|
|
|
Compare ICS93V857YGLFT with alternatives
Compare ICS86953BYIT-147 with alternatives