ICS93V857YGLFT
vs
MC100ES8011PEF
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TSSOP
|
SOIC
|
| Package Description |
6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48
|
LEAD FREE, MS-012AA, SOIC-8
|
| Pin Count |
48
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
12.5 mm
|
4.9 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
48
|
8
|
| Number of True Outputs |
10
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.1 ns
|
0.02 ns
|
| Seated Height-Max |
1.2 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.1 mm
|
3.9 mm
|
| fmax-Min |
170 MHz
|
|
| Base Number Matches |
1
|
2
|
| Family |
|
100E
|
| Moisture Sensitivity Level |
|
1
|
| Propagation Delay (tpd) |
|
0.94 ns
|
| Technology |
|
ECL
|
|
|
|
Compare ICS93V857YGLFT with alternatives
Compare MC100ES8011PEF with alternatives