ICS9DB108YGLNT
vs
PI6CVF857ZBE
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
PERICOM SEMICONDUCTOR CORP
|
| Part Package Code |
TSSOP
|
QFN
|
| Package Description |
TSSOP,
|
VQCCN,
|
| Pin Count |
48
|
40
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
9DB
|
6C
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
R-PDSO-G48
|
S-XQCC-N40
|
| JESD-609 Code |
e3
|
|
| Length |
12.5 mm
|
6 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
48
|
40
|
| Number of True Outputs |
8
|
10
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
VQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.05 ns
|
0.1 ns
|
| Seated Height-Max |
1.2 mm
|
0.84 mm
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
6.1 mm
|
6 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| fmax-Min |
|
210 MHz
|
|
|
|
Compare ICS9DB108YGLNT with alternatives
Compare PI6CVF857ZBE with alternatives