ID82C55A
vs
CA82C55A-8ID
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
TUNDRA SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
HERMETIC SEALED, CERAMIC, DIP-40
|
|
| Pin Count |
40
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
2.5 MHz
|
8 MHz
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-CDIP-T40
|
R-XDIP-T40
|
| Length |
52.324 mm
|
|
| Number of I/O Lines |
24
|
24
|
| Number of Ports |
3
|
3
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.715 mm
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
|
| uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
| Base Number Matches |
7
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
DIP40,.6
|
| Supply Current-Max |
|
10 mA
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare ID82C55A with alternatives
Compare CA82C55A-8ID with alternatives