IDT54FCT827BDB
vs
QS54FCT827ATD
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
QUALITY SEMICONDUCTOR INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP24,.3
|
|
| Pin Count |
24
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH DUAL OUTPUT ENABLE
|
WITH DUAL OUTPUT ENABLE
|
| Control Type |
ENABLE LOW
|
|
| Count Direction |
UNIDIRECTIONAL
|
|
| Family |
FCT
|
FCT
|
| JESD-30 Code |
R-CDIP-T24
|
R-CDIP-T24
|
| JESD-609 Code |
e0
|
|
| Load Capacitance (CL) |
300 pF
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.032 A
|
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Power Supply Current-Max (ICC) |
14.5 mA
|
|
| Prop. Delay@Nom-Sup |
6.5 ns
|
|
| Propagation Delay (tpd) |
14 ns
|
9 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
2
|
| Package Style |
|
IN-LINE
|
|
|
|
Compare IDT54FCT827BDB with alternatives
Compare QS54FCT827ATD with alternatives