IDT5T9306NLGI8
vs
IDT5T9306PFI
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQCC-N28
|
S-PQFP-G32
|
JESD-609 Code |
e3
|
e0
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Moisture Sensitivity Level |
1
|
3
|
Number of Terminals |
28
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCN
|
LQFP
|
Package Equivalence Code |
LCC28,.24SQ,25
|
QFP32,.35SQ,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLATPACK, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
225
|
Prop. Delay@Nom-Sup |
1.75 ns
|
1.75 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
QFP
|
Package Description |
|
LQFP, QFP32,.35SQ,32
|
Pin Count |
|
32
|
Input Conditioning |
|
DIFFERENTIAL MUX
|
Length |
|
7 mm
|
Number of Functions |
|
1
|
Number of Inverted Outputs |
|
|
Number of True Outputs |
|
6
|
Propagation Delay (tpd) |
|
1.75 ns
|
Same Edge Skew-Max (tskwd) |
|
0.025 ns
|
Seated Height-Max |
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
|
2.7 V
|
Supply Voltage-Min (Vsup) |
|
2.3 V
|
Width |
|
7 mm
|
fmax-Min |
|
1000 MHz
|
|
|
|
Compare IDT5T9306NLGI8 with alternatives
Compare IDT5T9306PFI with alternatives