IDT71V2576YSA150BGG vs MT55L256V18P1B-6 feature comparison

IDT71V2576YSA150BGG Integrated Device Technology Inc

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MT55L256V18P1B-6 Micron Technology Inc

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Source Content uid IDT71V2576YSA150BGG
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Part Package Code BGA BGA
Package Description GREEN, BGA-119 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119
Pin Count 119 119
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.8 ns 3.5 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e1 e0
Length 22 mm 22 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 36 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 131072 words 262144 words
Number of Words Code 128000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX36 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.36 mm 2.4 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 2
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Power Supplies 2.5,3.3 V
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.5 mA

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