IDT71V2576YSA150BGG vs MT55L256V18P1B-6 feature comparison

IDT71V2576YSA150BGG Integrated Device Technology Inc

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MT55L256V18P1B-6 Micron Technology Inc

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Source Content uid IDT71V2576YSA150BGG
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description GREEN, BGA-119 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119
Pin Count 119 119
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.8 ns 3.5 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e1 e0
Length 22 mm 22 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 36 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 131072 words 262144 words
Number of Words Code 128000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX36 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.36 mm 2.4 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 2
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Power Supplies 2.5,3.3 V
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.5 mA

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