IDT73720AJ
vs
IDT73720APQF8
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
LCC
|
QFP
|
| Package Description |
PLASTIC, LCC-68
|
QFP,
|
| Pin Count |
68
|
80
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
BYTE CONTROL ON ALL THREE PORTS
|
BYTE CONTROL ON ALL THREE PORTS
|
| Family |
73
|
73
|
| JESD-30 Code |
S-PQCC-J68
|
S-PQFP-G80
|
| JESD-609 Code |
e0
|
e0
|
| Length |
24.2062 mm
|
14 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS EXCHANGER
|
BUS EXCHANGER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Ports |
3
|
3
|
| Number of Terminals |
68
|
80
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QFP
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
QFP80,.7SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Propagation Delay (tpd) |
7 ns
|
7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2.45 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
24.2062 mm
|
14 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare IDT73720AJ with alternatives
Compare IDT73720APQF8 with alternatives