IDT74ALVCH16244PAG8
vs
SN74LVTH16244AGQLR
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
TSSOP,
|
VFBGA-56
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ALVC/VCX/A
|
LVT
|
| JESD-30 Code |
R-PDSO-G48
|
R-PBGA-B56
|
| JESD-609 Code |
e3
|
e0
|
| Length |
12.5 mm
|
7 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
4
|
4
|
| Number of Functions |
4
|
4
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
48
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
VFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Propagation Delay (tpd) |
3.7 ns
|
3.7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
6.1 mm
|
4.5 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
56
|
| Control Type |
|
ENABLE LOW
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.064 A
|
| Package Equivalence Code |
|
BGA56,6X10,25
|
| Packing Method |
|
TR
|
| Prop. Delay@Nom-Sup |
|
3.2 ns
|
|
|
|
Compare IDT74ALVCH16244PAG8 with alternatives
Compare SN74LVTH16244AGQLR with alternatives