IDT74ALVCH32373BF vs PI74ALVCH32373NB feature comparison

IDT74ALVCH32373BF Integrated Device Technology Inc

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PI74ALVCH32373NB Pericom Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC PERICOM SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description LFBGA, BGA96,6X16,32 LFBGA, BGA96,6X16,32
Pin Count 96 96
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family ALVC/VCX/A ALVC/VCX/A
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0 e0
Length 13.5 mm 13.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 3
Number of Bits 8 8
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 225
Prop. Delay@Nom-Sup 3.6 ns 3.6 ns
Propagation Delay (tpd) 4.9 ns 5.9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.3 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 5.5 mm 5.5 mm
Base Number Matches 3 1
ECCN Code EAR99

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