IDT74AUC16240PAI vs IDT74AUC16240BVGI feature comparison

IDT74AUC16240PAI Integrated Device Technology Inc

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IDT74AUC16240BVGI Renesas Electronics Corporation

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC RENESAS ELECTRONICS CORP
Part Package Code TSSOP
Package Description TSSOP, TSSOP48,.3,20 TFBGA,
Pin Count 48
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW
Family AUC AUC
JESD-30 Code R-PDSO-G48 R-PBGA-B56
JESD-609 Code e0 e1
Length 12.5 mm 7 mm
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.0001 A
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 4 4
Number of Ports 4 4
Number of Terminals 48 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TFBGA
Package Equivalence Code TSSOP48,.3,20 BGA56,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 2.6 ns 2.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.05 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) TIN SILVER COPPER
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 6.1 mm 4.5 mm
Base Number Matches 1 1

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