IDT74AUC16245BVI8
vs
IDT74AUCH16245BVI
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
VFBGA-48
|
VFBGA-56
|
Pin Count |
48
|
56
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Control Type |
COMMON CONTROL
|
COMMON CONTROL
|
Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
Family |
AUC
|
AUC
|
JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B56
|
JESD-609 Code |
e0
|
e0
|
Length |
7 mm
|
7 mm
|
Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
Max I(ol) |
0.0001 A
|
0.0001 A
|
Number of Bits |
8
|
8
|
Number of Functions |
2
|
2
|
Number of Ports |
2
|
2
|
Number of Terminals |
48
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
VFBGA
|
Package Equivalence Code |
BGA56,6X10,25
|
BGA56,6X10,25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Packing Method |
TR
|
|
Propagation Delay (tpd) |
3.1 ns
|
3.1 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.05 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
Supply Voltage-Nom (Vsup) |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
4.5 mm
|
4.5 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare IDT74AUC16245BVI8 with alternatives
Compare IDT74AUCH16245BVI with alternatives