IDT74CBTLV16212PV8 vs CBTD16213DGG,112 feature comparison

IDT74CBTLV16212PV8 Integrated Device Technology Inc

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CBTD16213DGG,112 NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code SSOP TSSOP
Package Description SSOP, TSSOP, TSSOP56,.3,20
Pin Count 56 56
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family CBTLV/3B CBT/FST/QS/5C/B
JESD-30 Code R-PDSO-G56 R-PDSO-G56
Length 18.415 mm 14 mm
Logic IC Type BUS EXCHANGER BUS EXCHANGER
Number of Bits 2 12
Number of Functions 12 2
Number of Ports 4 4
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.794 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.3 V 4.5 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm 6.1 mm
Base Number Matches 1 1
JESD-609 Code e0
Package Equivalence Code TSSOP56,.3,20
Terminal Finish TIN LEAD

Compare IDT74CBTLV16212PV8 with alternatives

Compare CBTD16213DGG,112 with alternatives