IDT74CBTLV16292PF8
vs
IDT74CBTLV16292PV
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
TSSOP,
|
SSOP, SSOP56,.4
|
| Pin Count |
56
|
56
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
CBTLV/3B
|
CBTLV/3B
|
| JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
| Length |
11.3 mm
|
18.415 mm
|
| Logic IC Type |
BUS EXCHANGER
|
BUS EXCHANGER
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Ports |
3
|
3
|
| Number of Terminals |
56
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
225
|
| Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
2.794 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
20
|
| Width |
4.4 mm
|
7.493 mm
|
| Base Number Matches |
1
|
3
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
SSOP56,.4
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare IDT74CBTLV16292PF8 with alternatives
Compare IDT74CBTLV16292PV with alternatives