IDT74CBTLV3253PGG8
vs
74CBTLV3253PGG8
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
TSSOP
|
TSSOP
|
Package Description |
TSSOP-16
|
TSSOP-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Base Number Matches |
1
|
2
|
Manufacturer Package Code |
|
PGG16
|
Control Type |
|
ENABLE LOW
|
Count Direction |
|
BIDIRECTIONAL
|
Family |
|
CBTLV/3B
|
JESD-30 Code |
|
R-PDSO-G16
|
JESD-609 Code |
|
e3
|
Length |
|
5 mm
|
Logic IC Type |
|
BUS EXCHANGER
|
Moisture Sensitivity Level |
|
1
|
Number of Bits |
|
4
|
Number of Functions |
|
2
|
Number of Ports |
|
5
|
Number of Terminals |
|
16
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
|
3-STATE
|
Output Polarity |
|
TRUE
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TSSOP
|
Package Equivalence Code |
|
TSSOP16,.25
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
260
|
Power Supply Current-Max (ICC) |
|
0.01 mA
|
Prop. Delay@Nom-Sup |
|
0.15 ns
|
Propagation Delay (tpd) |
|
0.25 ns
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
|
2.5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
MATTE TIN
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
4.4 mm
|
|
|
|
Compare IDT74CBTLV3253PGG8 with alternatives
Compare 74CBTLV3253PGG8 with alternatives