IDT74CBTLV3253PGG8
vs
74CBTLV3253PW
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
NEXPERIA
|
| Part Package Code |
TSSOP
|
|
| Package Description |
TSSOP-16
|
TSSOP-16
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Base Number Matches |
1
|
4
|
| Control Type |
|
ENABLE LOW
|
| Count Direction |
|
BIDIRECTIONAL
|
| Family |
|
CBTLV/3B
|
| JESD-30 Code |
|
R-PDSO-G16
|
| JESD-609 Code |
|
e4
|
| Length |
|
5 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Logic IC Type |
|
BUS EXCHANGER
|
| Moisture Sensitivity Level |
|
1
|
| Number of Bits |
|
4
|
| Number of Functions |
|
2
|
| Number of Inputs |
|
1
|
| Number of Outputs |
|
4
|
| Number of Ports |
|
5
|
| Number of Terminals |
|
16
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
|
3-STATE
|
| Output Polarity |
|
TRUE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
0.05 mA
|
| Prop. Delay@Nom-Sup |
|
0.25 ns
|
| Propagation Delay (tpd) |
|
0.25 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
4.4 mm
|
|
|
|
Compare IDT74CBTLV3253PGG8 with alternatives
Compare 74CBTLV3253PW with alternatives