IDT74CBTLV3257Q8 vs IDT74CBTLV3257QG feature comparison

IDT74CBTLV3257Q8 Integrated Device Technology Inc

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IDT74CBTLV3257QG Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC RENESAS ELECTRONICS CORP
Part Package Code SOIC
Package Description SSOP, SSOP16,.25 SSOP, SSOP16,.25
Pin Count 16
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family CBTLV/3B CBTLV/3B
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e3
Length 4.9 mm 4.9 mm
Logic IC Type BUS EXCHANGER BUS EXCHANGER
Moisture Sensitivity Level 1 1
Number of Bits 4 4
Number of Functions 1 1
Number of Ports 3 3
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Equivalence Code SSOP16,.25 SSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240 260
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 30
Width 3.9116 mm 3.9116 mm
Base Number Matches 1 2
ECCN Code EAR99

Compare IDT74CBTLV3257Q8 with alternatives

Compare IDT74CBTLV3257QG with alternatives