IDT74FCT139CTQ8
vs
PI74FCT139TQX
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
PERICOM SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
QSOP-16
|
SSOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
FCT
|
FCT
|
Input Conditioning |
STANDARD
|
STANDARD
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
e0
|
Length |
4.9276 mm
|
4.9 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
2-LINE TO 4-LINE DECODER
|
2-LINE TO 4-LINE DECODER
|
Max I(ol) |
0.048 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
INVERTED
|
INVERTED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
SSOP
|
Package Equivalence Code |
SSOP16,.25
|
SSOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
240
|
|
Prop. Delay@Nom-Sup |
5 ns
|
|
Propagation Delay (tpd) |
5 ns
|
9 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7272 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
3.9 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IDT74FCT139CTQ8 with alternatives
Compare PI74FCT139TQX with alternatives