IDT74FCT151CTQ vs CY74FCT157CTPC feature comparison

IDT74FCT151CTQ Integrated Device Technology Inc

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CY74FCT157CTPC Cypress Semiconductor

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC CYPRESS SEMICONDUCTOR CORP
Part Package Code SOIC DIP
Package Description SSOP, SSOP16,.25 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family FCT FCT
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e0 e0
Length 4.9 mm 19.177 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.048 A 0.064 A
Moisture Sensitivity Level 1
Number of Functions 1 4
Number of Inputs 8 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Equivalence Code SSOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 5.8 ns 4.3 ns
Propagation Delay (tpd) 4.7 ns 5.2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.826 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.635 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 3.9116 mm 7.62 mm
Base Number Matches 2 1

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