IDT74FCT151CTQ vs N74F158N feature comparison

IDT74FCT151CTQ Integrated Device Technology Inc

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N74F158N NXP Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description SSOP, SSOP16,.25 DIP,
Pin Count 16
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family FCT F/FAST
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e0
Length 4.9 mm 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.048 A
Moisture Sensitivity Level 1
Number of Functions 1 4
Number of Inputs 8 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Equivalence Code SSOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 5.8 ns
Propagation Delay (tpd) 4.7 ns 8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.2 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.635 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 3.9116 mm 7.62 mm
Base Number Matches 2 1
Power Supply Current-Max (ICC) 19 mA

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