IDT74FST163232PF8
vs
IDTQS3390QG8
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SSOP
|
|
| Package Description |
TSSOP,
|
SSOP, SSOP28,.25
|
| Pin Count |
56
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
CBT/FST/QS/5C/B
|
3390
|
| JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G28
|
| JESD-609 Code |
e0
|
e3
|
| Length |
11.3 mm
|
9.906 mm
|
| Logic IC Type |
MULTIPLEXER AND DEMUX/DECODER
|
MULTIPLEXER
|
| Number of Functions |
16
|
1
|
| Number of Inputs |
1
|
16
|
| Number of Outputs |
2
|
1
|
| Number of Terminals |
56
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.7272 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
3.9116 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
SSOP28,.25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare IDT74FST163232PF8 with alternatives
Compare IDTQS3390QG8 with alternatives