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IDT74LVC157ADC8 vs 74LVC157ADB,118 feature comparison

IDT74LVC157ADC8 Integrated Device Technology Inc

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74LVC157ADB,118 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code SOIC SSOP1
Package Description SSOP,
Pin Count 16 16
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 9.9314 mm 6.2 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 3 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 5.9 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7272 mm 2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3.9 mm 5.3 mm
Base Number Matches 1 1
Manufacturer Package Code SOT338-1
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code SSOP16,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 6.5 ns
Time@Peak Reflow Temperature-Max (s) 30
Logic » Multiplexer/Demultiplexers
Logic » Multiplexer/Demultiplexers

Compare IDT74LVC157ADC8 with alternatives

Compare 74LVC157ADB,118 with alternatives