IDT74LVC16244APF vs 935277682551 feature comparison

IDT74LVC16244APF Integrated Device Technology Inc

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935277682551 NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description TSSOP, TSSOP48,.25,16 LFBGA,
Pin Count 48
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G48 R-PBGA-B96
JESD-609 Code e0 e0
Length 9.7 mm 13.5 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 4 8
Number of Ports 2 2
Number of Terminals 48 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP LFBGA
Package Equivalence Code TSSOP48,.25,16
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 4.1 ns
Propagation Delay (tpd) 4.7 ns 4.7 ns
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 1.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.4 mm 0.8 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 5.5 mm
Base Number Matches 4 1

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