IDT74LVCH162244APA
vs
IDT74LVC162244APAG
feature comparison
| Source Content uid |
IDT74LVCH162244APA
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
|
| Part Package Code |
TSSOP
|
|
| Package Description |
TSSOP, TSSOP48,.3,20
|
|
| Pin Count |
48
|
|
| Reach Compliance Code |
not_compliant
|
|
| HTS Code |
8542.39.00.01
|
|
| Control Type |
ENABLE LOW
|
|
| Family |
LVC/LCX/Z
|
|
| JESD-30 Code |
R-PDSO-G48
|
|
| JESD-609 Code |
e0
|
|
| Length |
12.5 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BUS DRIVER
|
|
| Max I(ol) |
12 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
4
|
|
| Number of Functions |
4
|
|
| Number of Ports |
2
|
|
| Number of Terminals |
48
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE WITH SERIES RESISTOR
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP48,.3,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Power Supplies |
3.3 V
|
|
| Prop. Delay@Nom-Sup |
4.4 ns
|
|
| Propagation Delay (tpd) |
5.6 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
6.1 mm
|
|
| Base Number Matches |
1
|
|
|
|
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