IDT79R3010A-16FJ
vs
IDT79R3010A16QJM
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
CAVITY UP, CERPACK-84
|
CAVITY UP, CERPACK-84
|
Pin Count |
84
|
84
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Barrel Shifter |
NO
|
NO
|
Boundary Scan |
NO
|
NO
|
Bus Compatibility |
R3000A; R3001
|
R3000A; R3001
|
Clock Frequency-Max |
33.33 MHz
|
33.33 MHz
|
External Data Bus Width |
32
|
32
|
JESD-30 Code |
S-GQCC-J84
|
S-GQCC-J84
|
JESD-609 Code |
e0
|
e0
|
Length |
29.21 mm
|
29.21 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Terminals |
84
|
84
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC84,1.2SQ
|
LDCC84,1.2SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
5.08 mm
|
Supply Current-Max |
525 mA
|
575 mA
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
29.21 mm
|
29.21 mm
|
uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, FLOATING POINT ACCELERATOR
|
MATH PROCESSOR, FLOATING POINT ACCELERATOR
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IDT79R3010A-16FJ with alternatives
Compare IDT79R3010A16QJM with alternatives