IDT82V3001APVG8
vs
IDT82V3001APV8
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
SSOP
|
SSOP
|
Package Description |
SSOP-56
|
SSOP,
|
Pin Count |
56
|
56
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
JESD-609 Code |
e3
|
e0
|
Length |
18.415 mm
|
18.415 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
56
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
SSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.794 mm
|
2.794 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin/Lead (Sn85Pb15)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
Width |
7.5 mm
|
7.5 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IDT82V3001APVG8 with alternatives
Compare IDT82V3001APV8 with alternatives