IDTQS3VH16212PA8
vs
IDTQS3VH800Q
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TSSOP
|
SOIC
|
| Package Description |
TSSOP,
|
SSOP, SSOP24,.24
|
| Pin Count |
56
|
24
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
CB3Q/3VH/3C/2B
|
CB3Q/3VH/3C/2B
|
| JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
14 mm
|
8.6614 mm
|
| Logic IC Type |
BUS EXCHANGER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
12
|
10
|
| Number of Functions |
2
|
1
|
| Number of Ports |
4
|
2
|
| Number of Terminals |
56
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Propagation Delay (tpd) |
0.2 ns
|
0.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.7272 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.1 mm
|
3.9116 mm
|
| Base Number Matches |
1
|
4
|
| Package Equivalence Code |
|
SSOP24,.24
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare IDTQS3VH16212PA8 with alternatives
Compare IDTQS3VH800Q with alternatives