IGB15N60TATMA1
vs
HGTG10N120BND
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
End Of Life
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
ON SEMICONDUCTOR
|
| Part Package Code |
D2PAK
|
|
| Package Description |
SMALL OUTLINE, R-PSSO-G2
|
FLANGE MOUNT, R-PSFM-T3
|
| Pin Count |
4
|
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
19 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
Infineon
|
onsemi
|
| Case Connection |
COLLECTOR
|
|
| Collector Current-Max (IC) |
30 A
|
35 A
|
| Collector-Emitter Voltage-Max |
600 V
|
1200 V
|
| Configuration |
SINGLE
|
SINGLE WITH BUILT-IN DIODE
|
| JEDEC-95 Code |
TO-263AB
|
TO-247
|
| JESD-30 Code |
R-PSSO-G2
|
R-PSFM-T3
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
3
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Transistor Application |
POWER CONTROL
|
MOTOR CONTROL
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Turn-off Time-Nom (toff) |
291 ns
|
330 ns
|
| Turn-on Time-Nom (ton) |
32 ns
|
32 ns
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
340CK
|
| Additional Feature |
|
LOW CONDUCTION LOSS
|
|
|
|
Compare IGB15N60TATMA1 with alternatives
Compare HGTG10N120BND with alternatives