IHLP2020BZER3R3M1A
vs
IHLP2020BZER3R3M11
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
VISHAY INTERTECHNOLOGY INC
|
| Package Description |
CHIP
|
CHIP
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
10 Weeks
|
11 Weeks, 3 Days
|
| Samacsys Manufacturer |
Vishay
|
Vishay
|
| Case/Size Code |
2020
|
2020
|
| Construction |
Rectangular
|
Rectangular
|
| Core Material |
COMPOSITE
|
COMPOSITE
|
| DC Resistance |
0.0578 Ω
|
0.0578 Ω
|
| Inductance-Nom (L) |
3.3 µH
|
3.3 µH
|
| Inductor Application |
HIGH CURRENT INDUCTOR
|
HIGH CURRENT INDUCTOR
|
| Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
| JESD-609 Code |
e3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
2 mm
|
2 mm
|
| Package Length |
5.18 mm
|
5.18 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
5.18 mm
|
5.18 mm
|
| Packing Method |
TR, 13 Inch
|
TR, 13 Inch
|
| Rated Current-Max |
4.1 A
|
4.1 A
|
| Reference Standard |
AEC-Q200
|
|
| Self Resonance Frequency |
29 MHz
|
29 MHz
|
| Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Shielded |
YES
|
YES
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
MATTE TIN OVER NICKEL
|
MATTE TIN OVER NICKEL
|
| Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Test Frequency |
0.1 MHz
|
0.1 MHz
|
| Tolerance |
20%
|
20%
|
| Base Number Matches |
1
|
1
|
|
|
|