INA216A3YFFR
vs
INA216A3RSWR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
QFN
|
| Package Description |
DSBGA-4
|
UQFN-10
|
| Pin Count |
4
|
10
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Common Mode Voltage-Max |
5.5 V
|
5.5 V
|
| Common-mode Reject Ratio-Min |
90 dB
|
90 dB
|
| Input Offset Voltage-Max |
75 µV
|
75 µV
|
| JESD-30 Code |
R-XBGA-B4
|
R-PQCC-N10
|
| JESD-609 Code |
e1
|
e4
|
| Length |
1.1 mm
|
1.8 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
10
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.625 mm
|
0.55 mm
|
| Slew Rate-Nom |
0.3 V/us
|
0.3 V/us
|
| Supply Current-Max |
0.03 mA
|
0.03 mA
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN SILVER COPPER
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.1 mm
|
1.4 mm
|
| Base Number Matches |
1
|
1
|
|
|
|