IP175DLFI
vs
KSZ8995MAI
feature comparison
Part Life Cycle Code |
Contact Manufacturer
|
Active
|
Ihs Manufacturer |
IC PLUS CORP
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
unknown
|
compliant
|
JESD-30 Code |
R-PQFP-G128
|
R-PQFP-G128
|
Length |
20 mm
|
20 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
128
|
128
|
Number of Transceivers |
1
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
FQFP
|
Package Equivalence Code |
QFP128,.68X.91,20
|
QFP128,.68X.91,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
Seated Height-Max |
3.42 mm
|
3.4 mm
|
Supply Voltage-Nom |
1.9 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
SUPPORT CIRCUIT
|
ETHERNET SWITCH
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
3
|
Rohs Code |
|
Yes
|
Package Description |
|
PQFP-128
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8517.70.00.00
|
Factory Lead Time |
|
14 Weeks, 4 Days
|
Samacsys Manufacturer |
|
Microchip
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Supply Current-Max |
|
230 mA
|
Technology |
|
CMOS
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare IP175DLFI with alternatives
Compare KSZ8995MAI with alternatives