IRF840
vs
SFF440-28
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Contact Manufacturer
|
Active
|
Ihs Manufacturer |
COMSET SEMICONDUCTORS
|
SOLID STATE DEVICES INC
|
Package Description |
TO-220AB, 3 PIN
|
CHIP CARRIER, S-CQCC-N28
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Avalanche Energy Rating (Eas) |
510 mJ
|
|
Case Connection |
DRAIN
|
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
500 V
|
500 V
|
Drain Current-Max (ID) |
8 A
|
8 A
|
Drain-source On Resistance-Max |
0.85 Ω
|
0.86 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-220AB
|
|
JESD-30 Code |
R-PSFM-T3
|
S-CQCC-N28
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
28
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
FLANGE MOUNT
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Pulsed Drain Current-Max (IDM) |
32 A
|
|
Surface Mount |
NO
|
YES
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Position |
SINGLE
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
LCC
|
Pin Count |
|
28
|
Power Dissipation-Max (Abs) |
|
36 W
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare IRF840 with alternatives
Compare SFF440-28 with alternatives