IRF9240SMD-JQR-BR4
vs
IRF9240EPBF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
TT ELECTRONICS PLC
|
INTERNATIONAL RECTIFIER CORP
|
Package Description |
CHIP CARRIER, R-CBCC-N3
|
FLANGE MOUNT, O-MBFM-P2
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Case Connection |
DRAIN
|
DRAIN
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
200 V
|
200 V
|
Drain Current-Max (ID) |
11 A
|
11 A
|
Drain-source On Resistance-Max |
0.5 Ω
|
0.58 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-276AB
|
TO-204AA
|
JESD-30 Code |
R-CBCC-N3
|
O-MBFM-P2
|
JESD-609 Code |
e4
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
2
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
METAL
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
CHIP CARRIER
|
FLANGE MOUNT
|
Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
Pulsed Drain Current-Max (IDM) |
44 A
|
44 A
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
GOLD
|
|
Terminal Form |
NO LEAD
|
PIN/PEG
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
HTS Code |
|
8541.29.00.95
|
Avalanche Energy Rating (Eas) |
|
500 mJ
|
Peak Reflow Temperature (Cel) |
|
260
|
Power Dissipation Ambient-Max |
|
125 W
|
Reference Standard |
|
CECC
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Transistor Application |
|
SWITCHING
|
Turn-off Time-Max (toff) |
|
150 ns
|
Turn-on Time-Max (ton) |
|
120 ns
|
|
|
|
Compare IRF9240SMD-JQR-BR4 with alternatives
Compare IRF9240EPBF with alternatives