IS24C02A-2SI vs AT24C02CU3-CUM-T feature comparison

IS24C02A-2SI Integrated Silicon Solution Inc

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AT24C02CU3-CUM-T Atmel Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC ATMEL CORP
Part Package Code TSSOP BGA
Package Description 0.120 INCH, LEAD FREE, PLASTIC, MO-187, MSOP-8 VFBGA,
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A991.B.1.B.1
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 1 MHz 1 MHz
Data Retention Time-Min 100 100
Endurance 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C Control Byte 1010DDDR 1010DDDR
JESD-30 Code S-PDSO-G8 R-PBGA-B8
JESD-609 Code e0 e3
Length 3 mm 2 mm
Memory Density 2048 bit 2097152 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 256 words 262144 words
Number of Words Code 256 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X8 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VFBGA
Package Equivalence Code TSSOP8,.19
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 0.85 mm
Serial Bus Type I2C I2C
Standby Current-Max 0.000001 A
Supply Current-Max 0.003 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL BOTTOM
Width 3 mm 1.5 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Write Protection HARDWARE
Base Number Matches 1 2
Additional Feature 100 YEAR DATA RETENTION

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